| 1 | PCB Layers | 1 – 12 layers |
| 2 | Laminate | Material | Flexible part: DuPont PI, Shengyi PI |
| Rigid part: PI/FR4 |
| FR4, for lead-free welding |
| low-loss material |
| Halogen free |
| Special materials: Rogers/Arlon/Nelco/Taconic etc |
| PTFE |
| Polyimide |
| 3 | Delivery Size | Delivery Size | 570X610mm | 570X610mm |
| Production size | 610X640mm | 610X640mm |
| 4 | Board Thickness | thinnest | 0.25 mm | 0.20 mm |
| thickest | 5.00 mm | 5.50 mm |
| 5 | Finished board thickness tolerance | ±2mil(±0.04m) |
| 6 | Copper Thickness | Inner Layer | 1/3-28 OZ | 1/3-30 OZ |
| Outer Layer | 1/7-28 OZ | 1/7-30 OZ |
| 7 | Inner Line | Minimum line width | 50μm | 50μm |
| Minimum line spacing | 75μm | 50μm |
| 8 | Outer Line | Minimum line width | 75μm | 50μm |
| Minimum line spacing | 75μm | 50μm |
| 9 | Min. mechanical Via hole, minimum pad | inner Layer | 0.45 mm | 0.40 mm |
| Outer Layer | 0.40 mm | 0.35 mm |
| 10 | Laser Via hole minimum pad | inner Layer | 0.25 mm | 0.23 mm |
| Outer Layer | 0.25 mm | 0.23 mm |
| 11 | Thickness to diameter ratio | LBMV | 1:1 | 1:1 |
| MVTH | 1:12 | 1:16 |
| 12 | Min. dielectric thickness | Inner core board | 0.025 mm | 0.025 mm |
| Prepreg | 0.05 mm | 0.05 mm |
| 13 | Solder resist | min. spacing | 60 μm | 40 μm |
| Min. Solder resist bridge | 75 μm | 65 μm |
| 14 | Buried capacitance | Insulation thickness: 14 μm |
| unit-area capacitance: 6.4 nF/in2 |
| Breakdown voltage: >100V |
| 15 | Buried resistor | Resistance per unit area(ohms/sq.) : 25, 50, 100, 200 |
| 16 | Impedance control accuracy | 10% | 5% |
| 17 | Plug hole | ink plughole |
| resin plug holes |
| copper slurry plughole |
| 18 | Min Tracing/Spacing | 2.5mil/2.5mil |
| 19 | Min. Annular Ring | 4mil |
| 20 | Min. Drilling Hole Diameter | 8mil(0.15mm) |
| 21 | Min. mechanical drilling | 0.15 mm | 0.15 mm |
| 22 | Laser aperture | 0.10-0.2 0mm | 0.10-0.20 mm |
| 23 | Min. finished via diameter | 6mil(0.15mm) |
| 24 | Tolerance of dimension | 3mil(0.076 mm) |
| 25 | Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
| 26 | Silkscreen Color | White, Black, Yellow |
| 27 | Surface Finish | OSP |
| HASL(Hot Air Solder Leveling) |
| HASL Lead-Free |
| Flash Gold |
| ENIG (Electroless Nickle/Immersion Gold) |
| Immersion Tin |
| Immersion Silver |
| 28 | Special technologies | Impedance Control+/-10% |
| Gold fingers |
| Stiffener (PI/FR4) |
| Peelable solder mask |
